型号:5646372-1 | 类别:背板 - 硬公制,标准 | 制造商:TE Connectivity |
封装:48-BSSOP(0.295",7.50mm 宽) | 描述:2MM HM,ASY,T-D,HDR,8R,176P,AP |
详细参数
类别 | 背板 - 硬公制,标准 |
---|---|
描述 | 2MM HM,ASY,T-D,HDR,8R,176P,AP |
系列 | Z-Pack |
制造商 | TE Connectivity |
连接器类型 | 接头,公引脚 |
连接器样式 | D 22 |
针脚数 | 176 |
加载的针脚数 | 全部 |
间距 | 0.079"(2.00mm) |
排数 | 8 |
安装类型 | 通孔 |
端接 | 压配式 |
连接器用途 | 背板 |
触头镀层 | 金 |
触头镀层厚度 | 30µin(0.76µm) |
包装 | 管件 |
供应商
深圳市科翼源电子有限公司 | 朱小姐13510998172 |
现代芯城(深圳)科技有限公司 | 董0755-82542579 |
北京上用科技有限公司 | 刘先生13910052844(微信同步) |
北京显周科技有限公司 | 刘先生13910052844(微信同步) |
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